Influence of the material properties on the thermal behaviour of a package

authored by: Kirsten Weide, Christian Keck, Xiaoying Yu
Abstract: The trend in microelectronic is increasing power density of IC devices in conjunction with decreasing package size. Out of this a consideration of the thermal behaviour of the package and its vicinity, caused by a strong influence of the operating temperature on the component lifetime and its reliability is needed. A better outlet of the dissipated power is necessary. The temperature distribution in a package is influenced by the heat conduction in the package, depending on the different heat conductivities of the used materials. Also convection must be taken into account. In this paper a finite element model of a SOP8 plastic package mounted on a printed circuit board was investigated. The influence of the material properties of the package epoxy, the adhesive, the chip carrier and the material of the printed circuit board on the temperature distribution was investigated. Also the influence of the area covered by the adhesive on the temperature behaviour and the mechanical stress was investigated.
Organisation(s): Faculty of Electrical Engineering and Computer Science
Type: Conference contribution
Pages: 112-121
No. of pages: 10
Publication date: 28.08.1998
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Electronic, Optical and Magnetic Materials, Condensed Matter Physics, Computer Science Applications, Applied Mathematics, Electrical and Electronic Engineering
Electronic version(s): https://doi.org/10.1117/12.324388 (Access: Closed)

BibTeX

@inproceedings{3e915222272f4f9f8d945958dd85a757,
title = "Influence of the material properties on the thermal behaviour of a package",
abstract = "The trend in microelectronic is increasing power density of IC devices in conjunction with decreasing package size. Out of this a consideration of the thermal behaviour of the package and its vicinity, caused by a strong influence of the operating temperature on the component lifetime and its reliability is needed. A better outlet of the dissipated power is necessary. The temperature distribution in a package is influenced by the heat conduction in the package, depending on the different heat conductivities of the used materials. Also convection must be taken into account. In this paper a finite element model of a SOP8 plastic package mounted on a printed circuit board was investigated. The influence of the material properties of the package epoxy, the adhesive, the chip carrier and the material of the printed circuit board on the temperature distribution was investigated. Also the influence of the area covered by the adhesive on the temperature behaviour and the mechanical stress was investigated.",
keywords = "Finite elements, Material properties, Mechanical stress, Packaging, Simulation, Temperature distribution, Thermal resistance",
author = "Kirsten Weide and Christian Keck and Xiaoying Yu",
note = "Copyright: Copyright 2005 Elsevier Science B.V., Amsterdam. All rights reserved.; Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV ; Conference date: 23-09-1998 Through 24-09-1998",
year = "1998",
month = aug,
day = "28",
doi = "10.1117/12.324388",
language = "English",
isbn = "0-8194-2969-4",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
pages = "112--121",
booktitle = "Microelectronic manufacturing, yield, reliability, and failure analysis IV",
address = "United States",
}