Investigations of mechanical stress and electromigration in an aluminum meander structure

authored by: Xiaoying Yu, Kirsten Weide
Abstract: For reliability prediction in metallization structures the different migration mechanisms like electro-thermo- and stressmigration (due to mismatch of thermal expansion and elastic moduli) become more and more important. With numerical methods like the finite element methode FEM, it is possible to determine the weakest part of a metallization structure. In this paper the mechanical stress distribution as well as the mass flux and mass flux divergence due to electrical, mechanical and thermal effects will be investigated and correlated with measurements. In the investigations an unpassivated aluminum-meander test structure was used. For the aluminum meander structure the current density, temperature gradients and mechanical stress distributions were determined by finite element simulations with the FEM-program ANSYS. The resistivity as well as the activation energy was determined by measurements. Based on the results of the simulations the mass flux due to mechanical stress were calculated and compared with the calculated electro- and therrnomigration mass flux.
Organisation(s): Laboratorium f. Informationstechnologie
Type: Conference contribution
Pages: 160-166
No. of pages: 7
Publication date: 11.09.1997
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Electronic, Optical and Magnetic Materials, Condensed Matter Physics, Computer Science Applications, Applied Mathematics, Electrical and Electronic Engineering
Electronic version(s): https://doi.org/10.1117/12.284698 (Access: Closed)

BibTeX

@inproceedings{1d4f9590ecdc4f20abdfec27b1e2dc1b,
title = "Investigations of mechanical stress and electromigration in an aluminum meander structure",
abstract = "For reliability prediction in metallization structures the different migration mechanisms like electro-thermo- and stressmigration (due to mismatch of thermal expansion and elastic moduli) become more and more important. With numerical methods like the finite element methode FEM, it is possible to determine the weakest part of a metallization structure. In this paper the mechanical stress distribution as well as the mass flux and mass flux divergence due to electrical, mechanical and thermal effects will be investigated and correlated with measurements. In the investigations an unpassivated aluminum-meander test structure was used. For the aluminum meander structure the current density, temperature gradients and mechanical stress distributions were determined by finite element simulations with the FEM-program ANSYS. The resistivity as well as the activation energy was determined by measurements. Based on the results of the simulations the mass flux due to mechanical stress were calculated and compared with the calculated electro- and therrnomigration mass flux.",
keywords = "Electromigration, Finite element, Mechanical stress, Metallization, Simulation",
author = "Xiaoying Yu and Kirsten Weide",
note = "Copyright: Copyright 2009 Elsevier B.V., All rights reserved.; Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III ; Conference date: 01-10-1997 Through 01-10-1997",
year = "1997",
month = sep,
day = "11",
doi = "10.1117/12.284698",
language = "English",
isbn = "0-8194-2648-2",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
pages = "160--166",
booktitle = "Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III",
address = "United States",
}