3-dimensional simulations of temperature and current density distribution in a via structure

authored by

K. Weide, W. Hasse

Abstract

The influence of geometry (overlap, step coverage, filling ratio) and filling material on temperature and current density distributions in via structures of different forms and technologies simulated with the finite element method program ANSYS was studied. Vias of square, circular, and oval forms were investigated. The influence of via filling was observed. Reduction of current crowding and self-heating effects were found for the tungsten-filled via. Critical parameters for the filling materials were determined. Local temperature and current density distributions are shown.

Organisation(s)

Laboratorium f. Informationstechnologie

Type

Conference contribution

Pages

361-365

No. of pages

5

Publication date

1992

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality

Electronic version(s)

https://doi.org/10.1109/relphy.1992.187670 (Access: Unknown)