3-dimensional simulations of temperature and current density distribution in a via structure

verfasst von

K. Weide, W. Hasse

Abstract

The influence of geometry (overlap, step coverage, filling ratio) and filling material on temperature and current density distributions in via structures of different forms and technologies simulated with the finite element method program ANSYS was studied. Vias of square, circular, and oval forms were investigated. The influence of via filling was observed. Reduction of current crowding and self-heating effects were found for the tungsten-filled via. Critical parameters for the filling materials were determined. Local temperature and current density distributions are shown.

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Typ

Aufsatz in Konferenzband

Seiten

361-365

Anzahl der Seiten

5

Publikationsdatum

1992

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik, Sicherheit, Risiko, Zuverlässigkeit und Qualität

Elektronische Version(en)

https://doi.org/10.1109/relphy.1992.187670 (Zugang: Unbekannt)