Effect of Bond Hardness of Additively Manufactured Grinding Tool Bonds on Material Removal Efficiency during Single-Grain Cutting

authored by: Berend Denkena, Thomas Weißgärber, Thomas Studnitzky, Benjamin Bergmann, Alexander Strauß, Lennart Puls
Abstract: In order to gain insight into the material removal mechanism of abrasive machining processes, single-grain cutting is a useful and widely adopted technique. In most of the works on this subject, the single abrasive grains are bonded to a substrate by soldering, electroplating or simple adhesive bonding. As a result, the grinding tool bond’s influence is largely neglected. This publication shows a new variant of single-grain cutting that makes it possible to quantify the influence of the bond on the material removal mechanism. Specimens with different bond hardness are prepared using a sintering-based additive printing process. In single-grain cutting experiments, the influence of the Rockwell hardness of different bond types on the material removal efficiency was investigated. Among other things, a reduction in the specific scratch energy by 40% and an increase in the grinding force ratio by 70% were found when using an iron-based bond with increased hardness, compared to a softer, steel-based bond. This is a result of an increased grain protrusion under load for the grains in the harder bonds which leads to an increased material removal efficiency.
Organisation(s): Institute of Production Engineering and Machine Tools
External Organisation(s): Fraunhofer Institute for Manufacturing Technology and Advanced Materials (IFAM)
Technische Universität Dresden
Type: Article
Journal: Journal of Materials Engineering and Performance
No. of pages: 10
ISSN: 1059-9495
Publication date: 30.01.2025
Publication status: E-pub ahead of print
Peer reviewed: Yes
ASJC Scopus subject areas: General Materials Science, Mechanics of Materials, Mechanical Engineering
Electronic version(s): https://doi.org/10.1007/s11665-025-10689-6 (Access: Open)

BibTeX

@article{6a4faa0d5b90446887d630c7a414b91b,
title = "Effect of Bond Hardness of Additively Manufactured Grinding Tool Bonds on Material Removal Efficiency during Single-Grain Cutting",
abstract = "In order to gain insight into the material removal mechanism of abrasive machining processes, single-grain cutting is a useful and widely adopted technique. In most of the works on this subject, the single abrasive grains are bonded to a substrate by soldering, electroplating or simple adhesive bonding. As a result, the grinding tool bond{\textquoteright}s influence is largely neglected. This publication shows a new variant of single-grain cutting that makes it possible to quantify the influence of the bond on the material removal mechanism. Specimens with different bond hardness are prepared using a sintering-based additive printing process. In single-grain cutting experiments, the influence of the Rockwell hardness of different bond types on the material removal efficiency was investigated. Among other things, a reduction in the specific scratch energy by 40% and an increase in the grinding force ratio by 70% were found when using an iron-based bond with increased hardness, compared to a softer, steel-based bond. This is a result of an increased grain protrusion under load for the grains in the harder bonds which leads to an increased material removal efficiency.",
keywords = "additive manufacturing, bond hardness, material removal efficiency, single-grain cutting",
author = "Berend Denkena and Thomas Wei{\ss}g{\"a}rber and Thomas Studnitzky and Benjamin Bergmann and Alexander Strau{\ss} and Lennart Puls",
note = "Publisher Copyright: {\textcopyright} The Author(s) 2025.",
year = "2025",
month = jan,
day = "30",
doi = "10.1007/s11665-025-10689-6",
language = "English",
journal = "Journal of Materials Engineering and Performance",
issn = "1059-9495",
publisher = "Springer New York",
}