Broadband modeling and measurement of the signal behavior in S/390 MCM packages

authored by

Faïez M. Ktata, Uwe Arz, Hartmut Grabinski

Abstract

In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.

Organisation(s)

Laboratorium f. Informationstechnologie

Type

Article

Journal

IEEE Transactions on Advanced Packaging

Volume

23

Pages

375-381

No. of pages

7

ISSN

1521-3323

Publication date

2000

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1109/6040.861550 (Access: Closed)