Broadband modeling and measurement of the signal behavior in S/390 MCM packages

verfasst von

Faïez M. Ktata, Uwe Arz, Hartmut Grabinski

Abstract

In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements we validate the models in a frequency range up to 3 GHz.

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Typ

Artikel

Journal

IEEE Transactions on Advanced Packaging

Band

23

Seiten

375-381

Anzahl der Seiten

7

ISSN

1521-3323

Publikationsdatum

2000

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1109/6040.861550 (Zugang: Geschlossen)