Effect of elevated temperature on the bond behaviour of adhesive shear joints between glass substrate and iron-based shape memory alloy strip
- verfasst von
- Zhikang Deng, Vlad Alexandru Silvestru, Lingzhen Li, Elyas Ghafoori, Andreas Taras
- Abstract
Glass has been increasingly used as structural elements, such as glass beams or fins. Previous feasibility studies have shown increased initial and post-fracture load-bearing capacity of laminated glass beams post-tensioned with adhesively bonded iron-based shape memory alloy (Fe-SMA) strips. However, the potential elevated service temperatures were not considered, which significantly degraded the material properties of the adhesive. This study experimentally investigated the mechanical behaviour of Fe-SMA-to-glass lap-shear joints with an epoxy adhesive at different temperatures of 23 °C, 50 °C, and 80 °C, representing room temperature and typical elevated service temperatures. The results showed that, compared with the one at room temperature, the load-carrying capacity remained nearly unchanged at 50 °C and decreased by approximately 20 % at 80 °C. On the contrary, the effective bond length increased from approximately 116 mm to 250–300 mm. The failure modes, the tensile strain of the iron-based shape memory alloy, the bond-slip behaviour, and the fracture energy of the joints were also evaluated. The current study fills a significant research gap in the engineering application of strengthening glass structures by bonded pre-stressed Fe-SMA strips. Moreover, the results may also significantly contribute to the future application of the selected adhesive at elevated temperatures.
- Organisationseinheit(en)
-
Institut für Stahlbau
Fakultät für Bauingenieurwesen und Geodäsie
- Externe Organisation(en)
-
ETH Zürich
Eidgenössische Materialprüfungs- und Forschungsanstalt (EMPA)
Hong Kong Polytechnic University
- Typ
- Artikel
- Journal
- Construction and Building Materials
- Band
- 453
- ISSN
- 0950-0618
- Publikationsdatum
- 29.11.2024
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Tief- und Ingenieurbau, Bauwesen, Allgemeine Materialwissenschaften
- Elektronische Version(en)
-
https://doi.org/10.1016/j.conbuildmat.2024.138937 (Zugang:
Offen)