A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures

verfasst von: Yanpeng Gong, Yida He, Han Hu, Xiaoying Zhuang, Fei Qin, Hao Xu, Timon Rabczuk
Abstract: Dynamic loading is a critical factor influencing the reliability of electronic packaging, necessitating the development of efficient and accurate numerical methods tailored for studying electronic packaging reliability. This paper presents a coupled finite element–boundary element approach suitable for analyzing transient elastic dynamic response problems in electronic packaging structures. The core concept involves integrating the boundary element method into the finite element framework, thereby reducing the number of elements required for the finite element analysis of intricate electronic packaging geometries. Additionally, to leverage the powerful pre-processing and post-processing capabilities offered by commercial finite element software, the boundary element method is integrated into Abaqus, forming a finite element–boundary element coupling algorithm within this platform. In the numerical analysis process, the structure under investigation is first partitioned into finite element and boundary element domains according to its geometric characteristics and material properties. These distinct domains are then modeled separately within Abaqus, where material properties and element types are assigned. Compared to traditional numerical analysis methodologies for electronic packaging structures, this coupled algorithm fully capitalizes on the robust pre-processing and secondary development capabilities of Abaqus, effectively combining the advantages of both the finite element and boundary element methods while reducing the number of elements required in the finite element analysis. Numerical examples demonstrate the efficacy of this coupled algorithm in analyzing dynamic problems prevalent in electronic packaging structures.
Organisationseinheit(en): Institut für Photonik
Externe Organisation(en): Beijing University of Technology
Tongji University
Bauhaus-Universität Weimar
Typ: Artikel
Journal: Engineering structures
Band: 326
Anzahl der Seiten: 15
ISSN: 0141-0296
Publikationsdatum: 01.03.2025
Publikationsstatus: Veröffentlicht
Peer-reviewed: Ja
ASJC Scopus Sachgebiete: Tief- und Ingenieurbau
Elektronische Version(en): https://doi.org/10.1016/j.engstruct.2024.119500 (Zugang: Geschlossen)

BibTeX

@article{bcbce150ede24dffb4fd8a51a0b3d01a,
title = "A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures",
abstract = "Dynamic loading is a critical factor influencing the reliability of electronic packaging, necessitating the development of efficient and accurate numerical methods tailored for studying electronic packaging reliability. This paper presents a coupled finite element–boundary element approach suitable for analyzing transient elastic dynamic response problems in electronic packaging structures. The core concept involves integrating the boundary element method into the finite element framework, thereby reducing the number of elements required for the finite element analysis of intricate electronic packaging geometries. Additionally, to leverage the powerful pre-processing and post-processing capabilities offered by commercial finite element software, the boundary element method is integrated into Abaqus, forming a finite element–boundary element coupling algorithm within this platform. In the numerical analysis process, the structure under investigation is first partitioned into finite element and boundary element domains according to its geometric characteristics and material properties. These distinct domains are then modeled separately within Abaqus, where material properties and element types are assigned. Compared to traditional numerical analysis methodologies for electronic packaging structures, this coupled algorithm fully capitalizes on the robust pre-processing and secondary development capabilities of Abaqus, effectively combining the advantages of both the finite element and boundary element methods while reducing the number of elements required in the finite element analysis. Numerical examples demonstrate the efficacy of this coupled algorithm in analyzing dynamic problems prevalent in electronic packaging structures.",
keywords = "Abaqus implementation, Electronic packaging, FE–BE coupling method, Transient elastodynamics problem",
author = "Yanpeng Gong and Yida He and Han Hu and Xiaoying Zhuang and Fei Qin and Hao Xu and Timon Rabczuk",
note = "Publisher Copyright: {\textcopyright} 2024 Elsevier Ltd",
year = "2025",
month = mar,
day = "1",
doi = "10.1016/j.engstruct.2024.119500",
language = "English",
volume = "326",
journal = "Engineering structures",
issn = "0141-0296",
publisher = "Elsevier BV",
}